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Overview of spherical aluminum nitride AlN particles

Spherical aluminum nitride is an inorganic powder with high thermal conductivity. Due to its high thermal conductivity, good insulation, low dielectric constant, and the considerable expansion coefficient and excellent comprehensive properties of silicon materials, it is more and more favored by people. Note that it is widely used in large-scale integrated circuits, electronic substrates, high thermal conductivity, thermally conductive inorganic fillers, high-performance structural ceramics and other fields.

With the advent of the 5G era, various electronic devices are becoming more and more integrated and their functions are becoming more and more powerful. In order to improve the heat dissipation performance of various encapsulation resins used in the electronic field, the best way is to add inorganic insulating fillers with high thermal conductivity to the materials. Aluminum nitride is one of the best options. In order to increase the filling amount, the powder is required to be dense and spherical, and the particle size ranges from tens of microns to hundreds of microns, so as to ensure that the particle size and particle size of the composite material can achieve high filling and good fluidity.

Product properties of aluminum nitride AlN powder

The aluminum nitride powder (CAS 24304-00-5) sold by our company has high purity, ultra-fine particle size and high surface activity. The powder is treated with surface cloth, with extremely low oxygen content (<0.1%), thermal insulation and thermal conductivity. The performance effect is obvious.

How is aluminum nitride AlN powder produced?

Thermal Spray Process: Aluminum Nitride powders can be thermally sprayed to form electrically insulating and thermally conductive coatings. Chemical/Physical Vapor Deposition (CVD/PVD): Aluminum nitride coatings are deposited by CVD or PVDto provide an electrically insulating and thermally conductive coating.

Application of spherical aluminum nitride AlN particles

1. Manufacturing of high-performance ceramic devices: manufacturing integrated circuit substrates, electronic devices, optical devices, heat sinks, and high-temperature crucibles

2. Preparation of metal and polymer matrix composite materials: It has good application prospects especially in high temperature sealants and electronic packaging materials.

3. Nano-inorganic ceramic automotive lubricants and anti-wear agents. Nano-ceramic aluminum nitride ceramic nanoparticles are used as lubricants on the metal surface of engine friction pairs. They are activated by high temperature and extreme pressure and are highly permeable. In the depressions and pores of the metal surface, repair the damaged surface and form a nano-ceramic coating. Due to the isolation of this film, the frictional force is greatly reduced and the frictional force between the moving parts is reduced to almost zero. Although nano aluminum nitride powder is expensive, the addition amount in lubricating oil is only two thousandths, and the cost performance is very high.

4. For the manufacture of thermally conductive silica gel and thermally conductive epoxy resin. Ultra-high thermal conductivity nano-aluminum nitride composite silica gel has good thermal conductivity, good electrical insulation, wide electrical insulation temperature, low consistency and good construction performance. Widely used in the gap between CPU and heat sink, high-power transistors, thyristor elements, diodes, and heat transfer media at thin joints in contact with substrates.

5. The application of aluminum nitride powder in high thermal conductivity silicone rubber: the bottom aluminum and silicon nitride have good matching performance and are easy to disperse in the rubber. It can greatly improve the thermal conductivity of silicone rubber without affecting the mechanical properties of the rubber. Like oxides, the viscosity rises rapidly during the addition process, and the addition amount is very small. It is widely used in military, aviation and information engineering.

6. Other application fields: Nano-aluminum nitride is used for smelting non-ferrous metals and semiconductor GaAs crucibles, evaporation boats, thermocouple protection tubes, high-temperature insulating parts, microwave dielectric ceramic materials, high-temperature corrosion-resistant structures, microwave transparent aluminum nitride Ceramic products, currently used in PI resin, thermal insulation mica tape, thermal grease, insulating paint, thermal oil, etc.

Spherical Aluminum Nitride AlN Particles Price

The price of spherical aluminum nitride AlN particles will vary randomly with the production cost, transportation cost, international situation, exchange rate, market supply and demand and other factors of spherical aluminum nitride AlN particles. Tanki New Materials Co., Ltd. aims to help industries and chemical wholesalers find high-quality, low-cost nanomaterials and chemicals by providing a full range of customized services. If you are looking for Spherical Aluminum Nitride AlN Particles, please feel free to send an inquiry to get the latest price of Spherical Aluminum Nitride AlN Particles.

Spherical Aluminum Nitride AlN Particles Supplier

As a global supplier of spherical aluminum nitride AlN particles, Tanki New Materials Ltd. has extensive experience in the performance, application and cost-effective manufacturing of advanced and engineered materials. The company has successfully developed a series of powder materials (molybdenum disilicide), lanthanum nitride (LaN powder, calcium silicide, iron boride), high-purity targets, functional ceramics and structural devices, and provides OEM services.

Specification of Spherical Aluminum Nitride AlN Granule

Chemical Composition of Spherical Aluminum Nitride AlN Granule:
AlN	N	Fe	Mn	O	C	Ca	Si	Ni
＞99.5%	≥32%	0.04	0.0005	≤0.42	0.02	≤0.009	≤0.045	0.0002

Spherical Aluminum Nitride Properties
Other Names	Spherical Aluminium nitride, AlN granule
CAS No.	24304-00-5
Compound Formula	AlN
Molecular Weight	40.9882
Appearance	White to pale yellow powder
Melting Point	2200 °C
Boiling Point	2517 °C (dec.)
Density	2.9 to 3.3 g/cm3
Solubility in H2O	N/A
Electrical Resistivity	10 to 12 10x Ω-m
Poisson's Ratio	0.21 to 0.31
Specific Heat	780 J/kg-K
Thermal Conductivity	80 to 200 W/m-K
Thermal Expansion	4.2 to 5.4 µm/m-K
Young's Modulus	330 GPa
Exact Mass	40.9846
Monoisotopic Mass	40.9846
Spherical Aluminum Nitride Health & Safety Information
Remarks	Danger
Hazard Statements	H314-H335
Hazard Codes	Xi
Risk Codes	36/37/38
Safety Statements	26-37/39
RTECS Number	N/A
Transport Information	N/A
WGK Germany	3

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