Home > News > How To Solve The Problem Of Easy Oxidation And Easy Agglomeration Of Copper Electronic Paste?

How To Solve The Problem Of Easy Oxidation And Easy Agglomeration Of Copper Electronic Paste?

wallpapers News 2020-11-13
Titanium carbide aluminum powder is a good aluminum grain refiner developed in the past 20 years. Titanium aluminum carbide is a member of the MAX phase ceramic family.
 
The technical scheme adopted by the present invention is a preparation method of titanium aluminum carbon/copper electronic paste, which is specifically implemented according to the following steps:
 
Step 1. Prepare a mixed powder of spherical copper powder, flake copper powder and Ti3AlC2 powder and grind;
 
Step 2: Soak the mixed powder after grinding in Step 1 in an ascorbic acid solution, and then put it in a vacuum drying box for drying;

 
Step 3. The volume ratio of terpineol, ethyl cellulose, ethyl acetate, polyether defoamer, aminopropyltriethoxysilane and ascorbic acid is 60~80:6~10:6~15:2 ~5:2~5:1~2 Mix evenly, heat in a water bath until completely dissolved to obtain an organic carrier;
 
Step 4, the mixed powder obtained in step 2 and the organic carrier obtained in step 3 are uniformly mixed in a mass ratio of 60-75:25-40 to obtain a titanium aluminum carbon/copper electronic paste.

Say something
  • All comments(0)
    No comment yet. Please say something!
Tag: